中英制基本单位换算
1 kg=2.205 lb(磅)
1磅=0.454 kg
1英尺=12英寸
1 OZ(盎司)=28.3527g
1g=0.03527OZ
1英寸inch=1000密尔mil
1 ft(英尺)=0.3048m
1m=3.281ft
1mil=1000u”(uin mil)
1码=0.914m
1m=1.094码
1OZ=28.35克/平方英尺=35微米
1 in(英寸)=25.4mm
1mm=0.03937in
1in=1000mil=25.4mm,1mil=25.4um
1 m2=10.76 ft2
1 ft2=0.0929 m2
1ASD=1安培/平方分米=10.76安培/平方英尺
1磅力=4.4484牛顿
1N=0.2248磅力
1加仑美制=3.785升
1psi=0.06895bar
1bar=14.5psi=1.013kg/cm2
1bar=100000Pa
1马力=0.746千瓦
1 品脱=568 ml
1oC=1.8 x oC+32 oF
1 oF=( oF-32)/1.8 oC
1 英尺=30.5 cm
基本英文词汇
流程
Board cut开料Carbon printing碳油印刷
Inner dry film内层干膜Peelable blue mask蓝胶
Inner etching内层蚀刻
ENIG(Electroless nickel immersion gold)沉镍金
Inner dry film stripping内层干膜退膜 HAL(hot air leveling)喷锡
AOI （Automatic Optical Inspection）自动光学检测
OSP（Organic solderability preservative）有机保焊
Pressing压板Punching啤板
Drilling钻孔Profiling外形加工
Desmear除胶渣，去钻污 E-Test电性测试
PTH镀通孔，沉铜FQC(final quality control)最终品质控制
Panel plating整板电镀FQA(Final quality audit)最终品质保证
Outer dry film外层干膜Packing包装
Etching蚀刻IPQA(In-process quality audit)流程QA
Tin stripping退锡IPQC(In-process quality control)流程QC
EQC（QC after etching）蚀检QC
IQC(Incoming quality control)来料检查
Solder mask感阻MRB(material review board)材料评审委员会
Component mark字符QA(Quality assurance)品质保证
Physical Laboratory物理实验室QC(Quality control)品质控制
Chemistry Laboratory化学实验室Document control center文件控制中心
2nd Drilling 二钻Routing锣板，铣板
Brown oxidation棕化Waste water treatment污水处理
V-cutV坑WIP（work in process）半成品
Store/stock仓库F.G(Finished goods)成品
概述
Printed Circuit Board印制电路板Flexible Printed Circuit, FPC 软板
Double-Side Printed Board双面板
IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会
CPAR（Corrective & Preventive Action Request）要求纠正预防措施
Flammability Rate燃性等级Characteristic impedance特性阻抗
BUM（Build-up multilayer）积层多层板Date Code周期代码
CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染
Acceptance Quality Level (AQL)允收水平
HDI（High density interconnecting）高密度互连板
Base Material基材Radius半径
Capacity生产能力Diameter直径
Capability工艺能力PPM(Parts Per Million)百万分之几
CAM（computer-aided manufacturing)计算机辅助制造
Underwriters Laboratories Inc. 美国保险商实验所
CAD (computer-aided design)计算机辅助设计
Statistical Process Control统计过程控制
Specification规格，规范Via导通孔
Dimension尺寸Buried /blind via埋/盲孔
Tolerance公差Tooling hole定位孔
Oven焗炉Output/throughput产量
湿流程
PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning酸性除油
PP(Panel Plating)板电Acid dip酸洗
Pattern plating图电Pre-dip预浸
Line width线宽Alkaline cleaning碱性除油
Spacing线隙Flux松香
Deburring去毛刺（沉铜前磨板） Hot air leveling喷锡
Carbon treatment碳处理Skip plating跳镀，漏镀
Track/conductor导线Undercut侧蚀
Aspect ratio深径比Water rinsing水洗
Etch Factor蚀刻因子Transportation行车
Back Light Test背光测试Rack挂架
Pink ring粉红圈Maintenance保养
干流程
Hole location孔位Annular ring孔环
Image Transfer图象转移Component Side(C/S)元件面
Artwork底片Solder Side(S/S)焊接面
Mylar胶片Matte Solder Mask 哑绿油
Silkscreen/legend/Component Mark文字Hole breakout 破孔
Fiducial mark基点，对光点 Scrubbing磨板
Expose曝光Developing显影
内层制作
Core material内层芯板Thermal pad散热PAD
Pre-pregPP片Resin content树脂含量
Kraft Paper牛皮纸Brown oxidation棕化
Lay up排版Black Oxidation黑化
Registration对位Base material板材
Delamination分层
其它
Wicking灯芯效应Hole size孔径(尺寸)
Yield良品率Touch Up修理
Warp and Twist板曲度Solvent Test溶剂测试
Peel off剥离Company Logo公司标识
Tape Test胶纸试验UL MarkUL 标记
Cosmetic外观Function功能
Tin/Lead Ratio 锡/铅比例Reliability Tests可靠性试验
Hole Wall Roughness孔壁粗糙度Base Copper Thickness底铜厚度
PCB专业英语(PCB SPECIAL ENGLISH)
1.PCB=Printed Circuit Board 电路板
2.CAM=Computer aided manufacture 计算机辅助
3.Pad 焊盘
4.Annular ring 焊环
5.AOI=automatic optical inspection 自动光学检测
6.Charge of free 免费
7.WIP=work in process 在线板
8.DCC=document control center 文控中心
9.Legend 字符
10.CS=Component Side =Top Side （顶层）元件面
11.SS=Solder Side =Bottom Side （底层）焊锡面
12.Gold Plated 电金，镀金
13.Nickel Plated 电镍，镀镍
14.Immersion Gold 沉金=沉镍金
15.Carbon Ink Print 印碳油
16.Microsection Report 切片报告，横切面报告
17.X-out=Cross-out 打"X"报告
18.Panel （客户称）拼板，（生产线称）工作板
19.Marking 标记，UL 标记
20.Date code 生产周期
21.Unit 单元，单位
22.Profile 外形，轮廓<outline>
23.Profile By Routing 锣(铣)外形
24.Wet Film 湿菲林,湿绿油,湿膜
25.Slot 槽,方坑
26.Base Material=Base Laminate 基材,板料
27.V-out =V-score V形槽
28.Finished 成品
29.Marketing 市场部
30.Gerber File GERBER文件
31.UL LOGO UL标记
32.E-Test=Electric Open/Short Test 电子测试
33.PO=Purchase Order 订单
34.Tolerance 公差
35.Rigid,Flexible Board 刚性,软性板
36.Board cut 开料
37.Board baking 焗板
38.Drill 钻孔
39.PTH=Plated Through Hole 镀通孔,沉铜
40.Panel plating 板面电镀,全板电镀
41.Photo Image 图象,线路图形
42.Pattern plating 线路电镀
43.Etching 蚀板,蚀刻
44.SM=Solder Mask 防焊,阻焊,绿油
45.SR=Solder Resist 防焊,阻焊,绿油
46.Gold finger 金手指
47.Silkscreen 丝印字符
48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡
49.Routing 锣板,铣板
50.Punching 冲板,啤板
51.FOC=final quality checking 终检,最后检查
52.FOA=final quality audit 最后稽查(抽查)
53.Shippment 出货
54.Flux 松香
55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金
56.Lead free 无铅
57.COC=compliance of certificate 材料证明书
58.Microsection=cross section 微切片,横切片
59.Chamical gold 沉镍金
60.Mould=punch die 模具,啤模
61.MI=manufacture instruction 制作批示
62.QA=quality assurance 品质保证
63.CAD=computer aided design 计算机辅助设计
64.Drill bit size钻咀直径<diameter>
65.Bow and twist 板弯和板曲
66.Hit 击打,孔数
67.Bonding 邦定,点焊
68.Test coupon 测试模块(科邦)
69.Thieving copper 抢电流铜皮
70.Rail-web
71.Break-up tab 工艺边
72.Break away tab 工艺边
73.GND=ground 地线,大铜皮
74.Hole edge 孔边,孔内
75.Stamp hole 邮票孔
76.Template 天坯,型板,钻孔样板(首板)
77.Dry film 干菲林,干膜
78.LPI=liquid photo image 液态感光=湿绿油
79.Multilayer 多层板
80.SMD=surface mouted device 贴片,表面贴装器件
81.SMT=surface mouted technology 表面贴装技术
82.Peelable mask=blue gel 蓝胶
83.Tooling hole 工艺孔,管位,定位孔,工具孔
84.Fiducial mask 测光点,光学对位点,对光点,电眼
85.Copper foil 铜箔
86.Dimension 尺寸
87.Nagative负的,positive正的
88.Flash gold 闪镀金,镀薄金
89.Engineering department 工程部
90.Delivery date 交货期
91.Bevelling 斜边
92.Spacing=gap 间隙,气隙,线隙
PCB的各层定义及描述
